Nucleation for improved flash erase characteristics

ABSTRACT

The present invention provides a method for improving the erase speed and the uniformity of erase characteristics in erasable programmable read-only memories. This result is achieved by forming polycrystalline floating gate layers with optimized grain size on a tunnel dielectric layer. Nucleation sites are formed by exposing the tunnel dielectric layer to a first set of conditions including a first temperature and a first atmosphere selected to optimize nucleation site size and distribution density across the tunnel dielectric layer. A polycrystalline floating gate layer is formed on top of the nucleation sites by exposing the nucleation sites to a second set of conditions including a second temperature and a second atmosphere selected to optimize polycrystalline grain size and distribution density across the polycrystalline floating gate layer.

CLAIM OF PRIORITY

This application is a continuation application of, and claims priorityfrom U.S. patent application Ser. No. 09/639,580 now U.S. Pat. No.6,455,372, filed Aug. 14, 2000, which is incorporated in its entirety byreference herein.

FIELD OF THE INVENTION

The present invention generally relates to tailoring transistor gateelectrode crystal morphology for the formation of integrated circuits.More particularly, the invention relates to processes and structures forimproving the erase speed and the uniformity of erase characteristics inerasable programmable read-only memories (EEPROMs).

BACKGROUND OF THE INVENTION

Memory devices such as erasable programmable read-only memories(EPROMs), electrically erasable programmable read-only memories(EEPROMs), or flash erasable programmable read-only memories (FEPROMs)are erasable and reusable memory cells which are used in digitalcellular phones, digital cameras, LAN switches, cards for notebookcomputers, etc. A memory cell operates by storing electric charge(representing an “on” state) on an electrically isolated floating gate,which is incorporated into a transistor. This stored charge affects thebehavior of the transistor, thereby providing a way to read the memoryelement. The switching speed of such a memory cell for converting froman “on” state to an “off” state is limited in part by the speed ofcharge dissipation from the floating gate (i.e., the erase speed).Because faster erase speeds equate to faster switching speeds, effortshave been made to increase the erase speeds of such memory devices, aswell as to improve the erase uniformity among the memory cells.

A flash memory cell typically consists of a transistor, a floating gate,and a control gate above the floating gate in a stacked gate structure.The floating gate, typically composed of polycrystalline silicon (i.e.,“polysilicon”), is electrically isolated from the underlyingsemiconductor substrate by a thin dielectric layer, which is typicallyformed of silicon oxide. Because charge is transferred across thedielectric layer by quantum-mechanical tunneling, this dielectric layeris often referred to as a “tunnel oxide” layer. Such tunnel oxide layersare typically approximately 100 Å thick. Properties of the tunnel oxidemust be strictly controlled to ensure the ability to read and write bytunneling, while avoiding data loss through charge trapping or leakage.The control gate is positioned above the floating gate, and iselectrically isolated from the floating gate by a storage dielectriclayer, such as oxide-nitride-oxide (ONO). Electrical access to thefloating gate is therefore only through capacitors.

Storing charge on the floating gate programs a memory cell. This isachieved via hot-electron injection by applying a high positive voltage(approximately 12 V) to the control gate, and a high drain-to-sourcebias voltage (approximately 6 V). An inversion region is created betweenthe source and drain by the control gate voltage, and electrons areaccelerated from the source to the drain by the drain bias voltage. Somefraction of these electrons will have sufficient energy to surmount thetunnel oxide barrier height and reach the floating gate. The floatinggate is therefore programmed by collecting and storing these electronsto represent an “on” state.

An EPROM device can be erased (i.e., returned to an “off” state) byexposing the floating gate to ultraviolet light, which excites thestored electrons out of the floating gate. The erasure of an EEPROM orFEPROM cell is accomplished via Fowler-Nordheim tunneling, in whichapplying an electric field, which is sufficient for the stored electronsto traverse the tunnel oxide and enter the substrate, reduces the storedcharge in the floating gate. Under this mechanism for discharging thefloating gate, a large negative voltage (e.g., −10 V) is applied to thecontrol gate, and a positive voltage (e.g., 5-6 V) is applied to thesource while the drain is left floating. Electrons then tunnel from thefloating gate through the tunnel oxide, and are accelerated into thesource. Because both the programming and erasing of a memory elementtakes place via charge transfer processes across the tunnel oxide layer,it is important to minimize the defect density in this region that wouldotherwise create a mechanism for charge trapping or leakage through thetunnel oxide.

A variety of efforts have been aimed at improving the quality of thetunnel oxide and the floating gate for reliable and uniform write anderase characteristics. As critical dimensions continue to shrink,however, maintaining reliability and uniformity while increasingoperating speed becomes ever more challenging.

Accordingly, a need exists for improved flash memory device structuresand methods of fabrication.

SUMMARY OF THE INVENTION

In accordance with one aspect of the present invention, a method oftailoring the crystal morphology of a polysilicon floating gate layer ina flash memory device is provided. The method includes forming a tunneldielectric layer, and forming nucleation sites on top of the tunneldielectric layer under a first set of conditions comprising a firsttemperature and a first atmosphere. A polysilicon layer is formed on topof the nucleation sites under a second set of conditions different fromthe first set of conditions, the second set of conditions comprising asecond temperature and a second atmosphere.

In accordance with another aspect of the invention, a method oftailoring the erase speed and erase uniformity of a flash memory deviceis provided. The method includes forming a tunnel dielectric layer andforming a polysilicon floating gate layer on the tunnel dielectriclayer. The polysilicon floating gate layer has tailored polysilicongrain sizes.

In accordance with yet another aspect of the present invention, a methodof tailoring the crystal morphology of a crystalline transistorelectrode in an integrated circuit is provided. The method includesforming a dielectric layer, and forming nucleation sites on top of thedielectric layer by exposing the dielectric layer to a first set ofdeposition conditions selected to optimize grain density. Apolycrystalline layer is formed on top of the nucleation sites byexposing the nucleation sites to a second set of deposition conditionsselected to optimize grain size.

In accordance with yet another aspect of the present invention, apolysilicon floating gate layer in a flash memory device is provided.The polysilicon floating gate layer is formed by forming a tunneldielectric layer, and forming nucleation sites on top of the tunneldielectric layer under a first set of conditions comprising a firsttemperature and a first atmosphere. A polysilicon layer is formed on topof the nucleation sites under a second set of conditions different fromthe first set of conditions, the second set of conditions comprising asecond temperature and a second atmosphere.

In the illustrated embodiments, the crystal morphology of a polysiliconfloating gate layer in a flash memory cell is tailored for faster erasespeed and more uniform erase characteristics. Advantageously, byseparating the nucleation and growth of the polysilicon floating gatelayer, the crystal structure and distribution density of the nucleationsites can be selected independently of the polysilicon crystal growth.In this way, the distribution density and grain size of the polysiliconlayer can be optimized to produce polysilicon floating gate layers withfaster erase speeds and more uniform erase characteristics.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a flow chart, generally illustrating a process flow inaccordance with a preferred embodiment of the present invention.

FIG. 2A schematically illustrates a gate dielectric layer havingnucleation sites formed thereover, in accordance with the preferredembodiment of the present invention.

FIG. 2B illustrates the structure of FIG. 2A after formation of apolysilicon layer over the nucleation sites.

FIG. 3 illustrates a completed EEPROM device structure, constructed inaccordance with the preferred embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

While illustrated in the context of an electrically erasableprogrammable read only memory (EEPROM) device for flash memory circuits,persons skilled in the art will readily find application for the presentinvention to fabrication of other semiconductor integrated circuitdevices. In particular, methods disclosed herein are applicable toimproving the charge transfer characteristics of polysilicon layers in awide variety of transistor designs with a wide variety of process flows.The methods described herein, however, have particular utility forimproving the performance of polysilicon floating gate layers in flashmemory devices.

Erase speed of the floating gate is a limitation of the ultimateswitching speed of memory cells produced by current flash technology.This erase speed is controlled to a large degree by the crystalmorphology of the floating gate formed on top of the tunnel oxide. Forexample, a polycrystalline silicon (i.e., polysilicon) floating gatelayer has been shown to have a faster erase speed than an amorphoussilicon layer, due to the enhanced charge transport and dissipationalong the grain boundaries of the polysilicon layer. However, for apolysilicon layer with very large grains and dispersed grain boundaries(e.g., formed by the crystallization of a previously deposited amorphoussilicon layer), the erase speed of a given memory cell is non-uniformacross the floating gate layer. Devices with lower numbers of grains andgrain boundaries have per cell slower erase speeds than devices withhigher numbers of grains and grain boundaries per cell. In addition,different memory cells across one array may have different erasecharacteristics due to the varying grain structures from one cell toanother. Too great a variation in erase characteristics from one cell toanother can result in overerase of some cells, whereby the floating gatevoltage is lowered so much that the next write cycle cannot provideenough charge to read the cell as being in a charged or “1” state.

These non-uniformities will become even more pronounced and important infuture generations of flash memory devices as the sizes of memory cellsare reduced. It is therefore advantageous to design the crystalmorphology of the polysilicon floating gate to provide faster erasespeeds and improve erase uniformity among the fabricated memory cells.This result is achieved in the illustrated embodiment by formingpolysilicon floating gate layers with smaller grain sizes, which havecorrespondingly more numerous grain boundaries, thereby ensuring afaster and more uniform erase.

FIG. 1 is a flow chart which generally illustrates a process flow inaccordance with one preferred embodiment of the present invention, FIGS.2A and 2B illustrate the device structure corresponding to two stages ofthe floating gate formation, and FIG. 3 illustrates a completed flashmemory device. In the following description of the preferredembodiments, the named process flow steps are found in FIG. 1 and thenumbered structural elements refer to FIGS. 2A, 2B, and 3. It will beunderstood, however, that elements may differ in appearance duringfabrication as compared to the illustrated final structure. For example,while the stacked gate layers described below can be completed in anysuitable fashion, typically entailing numerous processing steps, theyare preferably blanket deposited upon one another prior to patterning ofthe gate electrode by photolithography and etch.

The EEPROM transistor 10 produced by the preferred embodiment of thepresent invention is fabricated over a semiconductor substrate 20, whichincludes doped regions defining transistor active areas. FIG. 1 includesproviding 100 such a semiconductor substrate 20. In the illustratedembodiment, the substrate 20 comprises the upper portion of asingle-crystal silicon wafer. In general, however, the substrate cancomprise any semiconductor structure or layer in which the lowest levelof integrated electrical devices are formed.

In the preferred embodiment of the present invention, the fabrication ofthe stacked gate structure begins with the formation 110 of a tunneldielectric layer 30 on the surface of the substrate 20. The tunneldielectric layer 30 of the illustrated embodiment comprises an oxide,and more particularly silicon dioxide, though the skilled artisan willappreciate that the present invention will have utility in conjunctionwith other types of dielectrics. An exemplary alternative oxidecomprises tantalum pentoxide (Ta₂O₅). In the illustrated embodiment,formation 110 of the tunnel dielectric layer 30 comprises thermaloxidation of the substrate surface, but persons skilled in the art areable to select an appropriate method of forming the tunnel dielectriclayer 30 from the various possible methods. The thickness of theillustrated tunnel dielectric layer 30 at this stage in the fabricationof the stacked gate structure 26 is typically between approximately 90 Åand 110 Å for a state-of-the-art flash memory cell.

In the illustrated embodiment, formation 120 of a floating gate 50 ontop of the tunnel dielectric layer 30 is achieved by a processcomprising a nucleation 122 and a bulk growth 124. The nucleation 122comprises exposing the tunnel dielectric layer 30 to a first set ofconditions comprising a first temperature and a first atmosphere. Duringthe nucleation 122, nucleation sites 40 (FIG. 2A) are formed on thetunnel dielectric layer 30 for subsequent polysilicon growth. Thepreferred embodiment of the present invention utilizes a firstatmosphere comprising a first hydride species which includes, but is notlimited to, silane (SiH₄) or disilane (Si₂H₆). Persons skilled in theart are able to select an appropriate first hydride species compatiblewith the present invention.

It has previously been shown that hemispherically-grainedpolycrystalline Si (HSG-Si) films can be fabricated on dielectric layersby first seeding an amorphaus silicon layer prior to polysiliconannealing. For example, U.S. Pat. Nos. 5,102,832 and 5,112,773 issued toTuttle, which are incorporated by reference herein, disclose theformation of texturized polysilicon by first sprinkling extremely smallparticles approximately 30 Å to 300 Å in diameter or by depositingpolysilicon nodules by chemical vapor deposition. These particles ornodules then serve as nucleation sites for subsequent HSG silicongrowth. In these applications, the goal has been to form texturizedHSG-Si layers with increased surface area, as compared to flatpolysilicon layers. Therefore, the nucleation sites for the creation ofHSG-Si films are spaced sufficiently apart to yield a highly texturizedpolysilicon layer. Conversely, in the preferred embodiment of thepresent invention, relatively flat polysilicon layers with small grainsizes are desired, thereby requiring different process parameters thanthe formation of HSG-Si films. Furthermore, polysilicon is seeded andformed over oxide or other dielectric, in contrast to HSG-Si; which isformed over polysilicon, and typically selectively formed to avoidseeding and deposition on adjacent insulating features.

Both the first temperature and first hydride species partial pressure(or alternatively, the first hydride species flow rate) influence thedistribution density of nucleation sites 40 across the surface of thetunnel dielectric layer 30. However, since the first temperature alsoinfluences the grain structure of the nucleation sites 40, the preferredembodiment of the present invention selects the first temperature tooptimize the grain structure of the nucleation sites 40, and selects thepartial pressure of the first hydride species to optimize thedistribution density of nucleation sites 40 across the surface of thetunnel dielectric layer 30.

If the first temperature is too low, then the resulting nucleation sites40 are amorphous and the distribution density of nucleation sites 40 ishigh. And if the first temperature is too high, the resulting nucleationsites 40 are polycrystalline. The temperature during the nucleation 122of the preferred embodiment is preferably between approximately 500° C.and 650° C., more preferably between approximately 575° C. and 630° C.

In the preferred embodiment of the present invention, the partialpressure of the first hydride species during the nucleation 122 isselected to provide sufficient flux of the first hydride species to thesurface of the tunnel dielectric layer 30 to form a film ofnon-continuous nucleation sites 40, without the growth of bulk silicon.While the total pressure of the first atmosphere of the nucleation 122is dependent in part on the deposition tool being used, the preferredranges of partial pressures of the first hydride species are notdependent on the deposition tool being used.

For single-wafer chambers, which are typically capable of achievingextremely low pressures, the total pressure of the first atmosphere ofthe nucleation 122 is substantially equal to the first hydride speciespartial pressure, which is preferably between approximately 10⁻⁷ Torrand 10⁻² Torr, more preferably between approximately 10⁻⁷ Torr and 10⁻³Torr, and most preferably between approximately 10⁻⁵ Torr and 10⁻³ Torr.In a typical single wafer tool, a corresponding gas flow rate of thefirst hydride species is preferably between approximately 1 sccm and 100sccm, and more preferably between approximately 10 sccm and 30 sccm.

For multi-wafer chambers (e.g., batch furnaces), which are typically notcapable of achieving total pressures below approximately 100 mTorr, thesame above-described first hydride species are used, with the remainderof the first atmosphere comprising inert gases such as Ar, Ne, He, orN₂. The corresponding gas partial pressure of the first hydride speciesis preferably between approximately 1 mTorr and 100 mTorr, morepreferably between approximately 10 mTorr and 50 mTorr.

The above ranges of first hydride species partial pressures and gas flowrates of the first atmosphere are substantially reduced from thosevalues typically used to grow bulk polysilicon films using theconventional techniques.

The exposure time of the tunnel dielectric layer 30 to the firstatmosphere to achieve sufficient nucleation sites 40 is dependent, inpart, on the first temperature, first hydride species partial pressure,and gas flow rate of the first atmosphere. For the above-describedranges of these values for single-wafer chambers, the exposure time ispreferably between approximately 10 seconds and 3 minutes, morepreferably between approximately 30 seconds and 90 seconds. For batchsystems, the exposure time is preferably between approximately 5 minutesand 60 minutes, and more preferably between approximately 10 minutes and30 minutes.

The resultant distribution density of nucleation sites 40 across thetunnel dielectric layer 30 is preferably between approximately 5/μm² and100/μm², more preferably between approximately 20/μm² and 80/μm², andmost preferably between approximately 30/μm² and 60/μm². In otherarrangements, persons skilled in the art will be able to select anappropriate set of values for the first temperature, first hydridespecies partial pressures, gas flow rates, and exposure time to producesufficient nucleation sites 40 on the surface of the tunnel dielectriclayer 30 in view of the disclosure herein.

Once the tunnel dielectric layer 30 has been exposed to the firsthydride species in the nucleation 122 to form the optimal size anddistribution density of nucleation sites 40, the bulk polysilicon growth124 comprises exposing the nucleation sites 40 to a second temperatureand a second atmosphere to provide the bulk deposition of a continuouspolysilicon layer on top of the nucleation sites 40 for the floatinggate 50. The growth 124 of the preferred embodiment is performed in situ(i.e., without removing the substrate 20 from the chamber in which thenucleation 122 is performed). More preferably, the transition fromnucleation 122 to growth 124 is continuous. Accordingly in the preferredembodiment, the second atmosphere during the growth 124 preferablycomprises a second hydride species which is the same as the firsthydride species used during the nucleation 122. Other embodiments of thepresent invention, however, place the substrate 20 into another chamberto perform the growth 124 ex situ.

In the preferred embodiment of the present invention, the secondtemperature and the partial pressure of the second hydride species ofthe second atmosphere during the growth 124 are selected to providesufficient flux of the second hydride species to the surface of thetunnel dielectric layer 30 to form a continuous polysilicon layeroptimized for the desired dopant profile and crystal morphology. For lowsecond temperatures, the resulting silicon film tends to be amorphous,with a high incorporation of dopants. For higher second temperatures,the resulting silicon film is more polycrystalline, with lessincorporation of dopants. The second temperature during the growth 124of the preferred embodiment is preferably between approximately 450° C.and 700° C., more preferably between approximately 500° C. and 700° C.,and most preferably between approximately 530° C. and 650° C.

While the total pressure of the second atmosphere of the growth 124 isdependent in part on the deposition tool being used, the preferredranges of partial pressure of the second hydride species are notdependent on the deposition tool being used. For single-wafer chambers,the total pressure of the second atmosphere of the growth 124 issubstantially equal to the second hydride species partial pressure plusthe partial pressure of the dopant gas. The dopant gas can be selectedfrom known sources for boron, phosphorous, arsenic, etc. The secondhydride species partial pressure is preferably between approximately 0.1Torr and 10 Torr. For multi-wafer chambers, the same above-describedsecond hydride species and dopant gas are used as in the nucleation 122,with the remainder of the second atmosphere comprising inert gases suchas Ar, Ne, He, or N₂. In general, conditions for bulk poly or amorphoussilicon deposition are well known for both single wafer and batchsystems.

The exposure time of the tunnel dielectric layer 30 to the secondatmosphere to achieve sufficient polysilicon layer growth is dependent,in part, on the second temperature, second hydride species partialpressure, and gas flow rate of the second atmosphere. For theabove-described ranges of these values for single-wafer chambers, theexposure time is preferably between approximately 1 second and 10minutes, more preferably between approximately 1 and 5 minutes. Forbatch systems, the exposure time is preferably between approximately 1min. and 60 min., more preferably between approximately 10 minutes and45 minutes. In other arrangements, persons skilled in the art will beable to select an appropriate set of values for the second temperature,second hydride species partial pressure, gas flow rate, and exposuretime to produce sufficient polysilicon layer growth on top of thenucleation sites 40.

As a result, the average polysilicon grain sizes are preferably betweenapproximately 25 Å and 500 Å.

Erase speeds of the resulting flash memory devices are preferablybetween approximately 100μ-sec and 100 m-sec, more preferably betweenapproximately 100μ-sec and 1 mSec, and most preferably betweenapproximately 150μ-sec and 199μ-sec. Erase uniformity of the resultingflash memory devices, measured by repair density for column erase, isthereby improved. Persons skilled in the art will be able to selectappropriate polysilicon grain sizes and grain densities for creatingflash memory devices with particular characteristics, including erasespeed and erase uniformity.

In the preferred embodiment, the doping of the floating gate 50 is insitu (i.e., while the floating gate 50 is being formed). In otherembodiments consistent with the present invention, the doping isperformed ex situ after the polysilicon deposition. Persons skilled inthe art are able to select appropriate doping methods for creating thefloating gate 50 with a particular set of characteristics.

By separating the formation 120 of the floating gate 50 into anucleation 122 and a growth 124, the distribution density of nucleationsites 40 can be selected independently of the polysilicon growthconditions. In this way, the polysilicon nucleation distribution densityand grain size can be optimized independently.

In some embodiments of the present invention, the transition from thenucleation 122 to the growth 124 is abrupt and non-continuous, dependingupon the response time of the temperature control systems. Typically,single wafer systems are capable of more rapid temperature ramping,resulting in an abrupt transition from nucleation to bulk growth.

With reference to FIG. 3, the formation 130 of the remaining portions ofthe stacked gate structure 26 continues by the formation of a storagedielectric layer 60 on the floating gate 50. In the illustratedembodiment, the storage dielectric layer 60 is composed ofoxide-nitride-oxide (ONO). The formation of this storage dielectriclayer 60 in the illustrated embodiment is performed by methods known inthe art. In other embodiments of the present invention, high dielectricmaterials may be employed in the storage dielectric layer 60 to improvethe capacitance of the EEPROM device. Persons skilled in the art canreadily select appropriate materials and methods for creating thestorage dielectric layer 60 for particular circuit designs.

The formation of the stacked gate structure 26 of the illustratedembodiment then continues by the formation of a control gate 70 over thestorage dielectric layer 60. In the illustrated embodiment, the controlgate 70 is composed of polysilicon, however, in other embodiments thecontrol gate 70 can be composed of various other conductive materials,including, but not limited to, metal and/or metal silicide. Uponformation of the control gate 70, a cap insulator layer 80 is preferablyformed, comprising an insulator such as silicon nitride or siliconoxide, over the control gate 70.

Upon patterning, such as by conventional photolithography and etchprocesses, the stacked gate structure 26 is defined, as illustrated inFIG. 3. Spacers 90 a and 90 b are formed along the sidewalls of thestacked gate structure 26. Conventional blanket deposition of aninsulating material followed by a directional spacer etch can beemployed for spacer formation.

The stacked gate structure 26 and other surrounding areas are thencovered by a substantially conformal liner layer 92. The liner 92comprises an insulating material, preferably incorporating both siliconand nitrogen. Preferred liner materials include silicon oxide, siliconnitride, silicon oxynitride or a multiple layer laminate including oneor both of nitride and oxynitride. The liner 92 can be formed by anysuitable manner, but is preferably formed by chemical vapor deposition(CVD) to ensure good step coverage over the topography of the patternedstacked gate structures 26 across the substrate 20.

Subsequent to forming the liner layer 92 in the preferred embodiment ofthe present invention, an interlevel insulating layer 94 is depositedover the structure. Typically composed of BPSG, the layer 94 serves toelectrically isolate underlying devices, such as the EEPROM transistor10, from overlying interconnects. Accordingly, the interlevel insulatinglayer 94 is preferably between about 6,000 Å and 20,000 Å in thickness.

After depositing the interlayer insulating layer 94, the integratedcircuit is completed by additional fabrication steps. Typically, suchsteps include metallization processes, interconnecting various devicesof the integrated circuit. In order to make contact electrical contactbetween metal layers and the electronic devices, holes or vias areetched through the interlevel dielectric layers, such as the interlevelinsulating layer 94, and then filled with conductive material 96.Contact to the control gate 70 and active areas in the substrate 20, forexample, require contact through the interlevel insulating layer 94 andthe liner layer 92.

The integrated circuit is then completed by formation of bond pads andfinal passivation, such as by deposition of a further silicon oxynitridelayer or other suitable passivation material (not shown). As will beappreciated by the skilled artisan, the passivation layer forms a sealagainst moisture or other corrosive agents.

Although described above in connection with particular embodiments ofthe present invention, it should be understood the descriptions of theembodiments are illustrative of the invention and are not intended to belimiting. Various modifications and applications may occur to thoseskilled in the art without departing from the true spirit and scope ofthe invention as defined in the appended claims.

I claim:
 1. A polysilicon floating gate layer formed by a methodcomprising: forming a tunnel dielectric layer; depositing nucleationsites on top of the tunnel dielectric layer under a first set ofdeposition conditions comprising a first temperature and a firstatmosphere; and depositing a polysilicon layer on top of the nucleationsites under a second set of deposition conditions different from thefirst set of deposition conditions, the second set of depositionconditions comprising a second temperature and a second atmosphere,wherein the polysilicon layer has a polysilicon grain density in a rangebetween approximately 5 per, μm² and 100 per μm².
 2. The polysiliconfloating gate layer of claim 1, wherein the first temperature isselected to optimize a grain structure of the nucleation sites.
 3. Thepolysilicon floating gate layer of claim 1, wherein the secondtemperature is selected to optimize a grain size of the polysiliconfloating gate layer.
 4. The polysilicon floating gate layer of claim 1,wherein the nucleation sites are formed in a vacuum chamber and thepolysilicon layer is deposited in the vacuum chamber.
 5. The polysiliconfloating gate layer of claim 1, wherein the nucleation sites aredeposited in a single-wafer chamber.
 6. The polysilicon floating gatelayer of claim 1, wherein the polysilicon layer is deposited in amulti-wafer process chamber.
 7. The polysilicon floating gate layer ofclaim 1, wherein the first atmosphere comprises a first hydride species.8. The polysilicon floating gate layer of claim 7, wherein the firstatmosphere further comprises Ar, Ne, He, or N₂.
 9. The polysiliconfloating gate layer of claim 7, wherein the first hydride speciescomprises a silane.
 10. The polysilicon floating gate layer of claim 7,wherein the first hydride species is selected from a group consisting ofSiH₄ and Si₂H₆.
 11. The polysilicon floating gate layer of claim 7,wherein the first hydride species has a partial pressure selected tooptimize a distribution density of nucleation sites across the tunneldielectric layer.
 12. The polysilicon floating gate layer of claim 7,wherein the first hydride species has a gas flow rate betweenapproximately 1 sccm and 100 sccm.
 13. The polysilicon floating gatelayer of claim 7, wherein the tunnel dielectric layer is exposed to thefirst set of conditions for a time between approximately 10 seconds and3 minutes.
 14. The polysilicon floating gate layer of claim 7, whereinthe second atmosphere comprises a second hydride species.
 15. Thepolysilicon floating gate layer of claim 14, wherein the secondatmosphere further comprises an inert gas.
 16. The polysilicon floatinggate layer of claim 14, wherein the second hydride species is the sameas a first hydride species used to deposit the nucleation sites.
 17. Thepolysilicon floating gate layer of claim 1, wherein the nucleation sitesare exposed to the second set of deposition conditions for a timebetween approximately 1 second and 60 minutes.
 18. The polysiliconfloating gate layer of claim 1, wherein the tunnel dielectric layer isexposed to the first set of deposition conditions for a time betweenapproximately 5 minutes and 60 minutes.
 19. A flash memory device havingan erase speed and an erase uniformity, the device comprising: a tunneldielectric layer; and a polysilicon floating gate layer on top of thetunnel dielectric layer, the polysilicon floating gate layer formed by aprocess comprising: depositing nucleation sites on top of the tunneldielectric layer by exposing the tunnel dielectric layer to a first setof deposition conditions; and depositing the polysilicon floating gatelayer on top of the nucleation sites by exposing the nucleation sites toa second set of deposition conditions different from the first set ofdeposition conditions, the polysilicon floating gate layer havingtailored polysilicon grain sizes and density, wherein the polysilicongrain density is in a range between approximately 5 per μm² and 100 perμm².
 20. The flash memory device of claim 19, wherein the polysilicongrain sizes are between approximately 25 Å and 500 Å.
 21. The flashmemory device of claim 19, wherein the polysilicon grain sizes arebetween approximately 50 Å and 200 Å.
 22. The flash memory device ofclaim 19, wherein the erase speed is between approximately 100μ-sec and150 m-sec.
 23. A crystalline transistor electrode having a tailoredcrystal morphology, the crystalline transistor electrode formed by amethod comprising: forming a dielectric layer; depositing nucleationsites on top of the dielectric layer by exposing the dielectric layer toa first set of deposition conditions selected to optimize grain density,wherein the grain density is in a range between approximately 5 per μm²and 100 per μm²; and depositing a polycrystalline layer on top of thenucleation sites by exposing the nucleation sites to a second set ofdeposition conditions selected to optimize grain size, wherein the grainsize is in a range between approximately 25 Å and 500 Å.
 24. A flashmemory device having an erase speed, the flash memory device comprising:a tunnel dielectric layer; and a polysilicon floating gate layer havingpolysilicon grain sizes and a polysilicon grain density, wherein thepolysilicon grain sizes are between approximately 25 Å and 500 Å, thepolysilicon grain density is between approximately 5 per μm² and 100 perμm², and the erase speed is between approximately 100μ-sec and 150m-sec.
 25. The flash memory device of claim 24, wherein the polysilicongrain sizes are between approximately 50 Å and 200 Å.
 26. The flashmemory device of claim 24, wherein the polysilicon grain density isbetween approximately 20 per μm² and 80 per μm².
 27. The flash memorydevice of claim 24, wherein the polysilicon grain density is betweenapproximately 30 per μm² and 60 per μm².
 28. The flash memory device ofclaim 24, wherein the erase speed is between approximately 100μ-sec and100 m-sec.
 29. The flash memory device of claim 24, wherein the erasespeed is between approximately 100μ-sec and 1 m-sec.